Capability — Hybrid / MCM / ASIC Manufacturing

Hybrid & MCM manufacturing.

ASIC design and programming, automated pick-and-place, Au/Al wirebonding, hermetic sealing, and Class 10,000 cleanroom assembly — built by a team that's supplied high-value circuits and assemblies to Oil & Gas for over 30 years.

30+ years supplying Oil & Gas
IPC Class III & ISO 9001
Class 10,000 cleanroom
50,000 sq ft facility
Capabilities

What we assemble.

ASIC Design & Programming

In-house ASIC design and programming, integrated with our engineering team's sensor development background.

Automated Pick-and-Place & Dispense

Automated dispense, pick-and-place, and wire bonding on high-mix, low-to-mid volume production.

Au/Al Wirebonding

Gold and aluminum wirebonding for die-level interconnects.

Hermetic Sealing

Hermetic package sealing for modules that can't tolerate moisture or contamination ingress.

Equipment

Built on the right tools.

Wire Bonders

Pick & Place

Dispense

Resistance Weld

Leak Test

Bond Pull / Die Shear

ESS

Die Stacking

Specifications

Module & power handling.

4″ × 6″Module size
1800VPower handling
2ACurrent handling
50,000 sq ftManufacturing floor, automated lines

Additional complexity supported: die stacking, integrated heat sinks, eutectic die attach.

Certifications & Standards

Qualified to the standards your program requires.

Active

IPC Class III

Active

ISO 9001:2015

Standard

Mil-883 / JDEC

Standard

AWES

30+ years. Not a new venture.

Before Quartztronics was a name, this team was already supplying high-value circuits and assemblies to Oil & Gas companies — the same discipline now applied to medical, aerospace & defense, and power generation programs.

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